Residual stress in titanium nitride films produced by RF ion plating.

Titanium Nitride Thin Films by the Electron Shower Process

Titanium nitride (TiN), a stable compound with the NaCl structure, has a wide range of properties which find applications in cutting tools, wear resistant parts, semiconductor metallization, and the jewelry industry. However, there are problems with preparing highly adhesive thin films which maintain good properties. Thin films of titanium nitride have been prepared by the Electron Shower (ES) ...

Temperature Dependence of Residual Stress in Titanium Nitride Coatings on Haynes 188 Superalloy

Residual stresses in TiN coatings deposited by a reactive ion process on Haynes 188 superalloy, for potential application in jet engines, were determined over the temperature range from 30–800 °C, using high temperature X-ray diffraction. In the as-coated condition the TiN films have a pronounced [111] orientation texture and a compressive room temperature stress of -10.5 GPa. After heating for...

Substrate Effects on the APCVD Growth of Titanium Nitride Films

Local electric-field-induced oxidation of titanium nitride films

Nanometer-scale patterning of TiN films grown on SiO2 /Si(001) has been demonstrated using the local electric-field-induced oxidation process with a conductive-probe atomic force microscope. The chemical composition of the modified TiN region was determined by micro-Auger electron spectroscopy and was found to consist of Ti, some trace amount of N, and O, suggesting the formation of titanium ox...

Residual Stress Variation in Polysilicon Thin Films

This paper compares the use of four mechanical methods for characterization of residual stress variation in low pressure chemical vapor deposited (LPCVD) polysilicon thin films deposited, doped, and annealed under different conditions. Stress was determined using buckling structures, vibrating microstructures, static rotating structures and the wafer curvature method. After deposition of 1.0 μm...